Yageo Passive Components on ICGOODFIND SiteMap
最新文章
- Kioxia & SanDisk Ship BiCS10 332-Layer 3D NAND Samples – 59% Density Jump
- onsemi NOA1212CUTAG Ambient Light Sensor: Key Features and Applications
- onsemi NCP81248MNTXG High-Performance Multi-Phase Buck Controller
- NL17SZ126DFT2G Single Buffer Gate: Datasheet, Application, and Key Features
- onsemi NJD35N04G N-Channel MOSFET Datasheet and Application Overview
- onsemi FQT5P10TF P-Channel Power MOSFET: Datasheet, Application Notes, and Circuit Design Guide
- Onsemi AMIS42770ICAW1G: High-Performance Automotive CAN Transceiver
- onsemi ESD7551N2T5G: Ultra-Low Capacitance ESD Protection Diode for High-Speed Data Lines
- MBR140SFT3G Schottky Diode: Datasheet, Pinout, and Application Circuits
- ZTE Microelectronics Invests RMB 100M to Establish Nanjing Semiconductor Subsidiary
- YAGEO Resistor & Capacitor Product Line Introduction | Full Coverage of Common Models
- Etched Solves AI Throttling with Low-Voltage Design – SRAM+HBM, 80%+ Utilization on Sparse MoE
- Tata Electronics Hit by 630GB Cyber Breach – Apple & Tesla Blueprints Dumped on Dark Web
- onsemi to Acquire Synaptics in $7B All‑Stock Deal, Expanding Edge AI Footprint
- TI Launches Integrated GaN Buck‑Boost Converters for High‑Power Density
- KYOCERA AVX Tantalum Capacitor Guide | Prefix Meaning, Key Parameters & Popular Models
- China’s Largest Automotive Chip Test Center Launches in Shanghai Lingang
- Micron and Anthropic Forge AI Infrastructure Partnership Across HBM, DRAM, and Equity
- ICGOODFIND: Electronic Component & IC Purchasing Guide | Essential Skills & Practical Tips for Beginners
- Intel and AMD Unite on ACE AI Compute Extension, Boosting x86 AI Performance Up to 16x
- ICgoodFIND 2026 Duanwu Festival Holiday Notice
- Bourns Popular Components Overview | Reference Guide for Engineers: Trimmers & Circuit Protection Devices
- NXP’s SAF8444 Single‑Chip Radar Brings ADAS to Entry‑Level EVs
- Li Auto’s Mach M100 Dataflow Chip Hits 1280 TOPS, Outperforms Nvidia ThorU
- Musk: Tesla AI6 Chip Could Set a New Record for Compute per Wafer
- TSMC 3nm Capacity Hits 175K Wafers/Month Yet Still Tight, H2 Price Hike Up to 15%
- AWS Launches Graviton5: 3nm, 192 Cores, DDR5‑8800, PCIe Gen 6 – First 3nm Cloud Arm CPU
- Jiangbolong VP Files for $31M Stock Sale After 840% Rally – Second Stake Reduction
- China GPU ‘Four Dragons’ Member Enflame Nears STAR Market IPO Hearing, Targets $825M Raise
- Shenzhen Huaqiang Confirms Price Hikes on Some HiSilicon Chips, Sees Broad Component Upturn
- TI DSP Chip Overview: Features & Typical Applications of Popular TMS320 Series Models
- Shenzhen University Launches Integrated Circuit School to Boost Chip Talent Pipeline
- Broadcom Q2 Net Income Soars 87.5% to $9.31B, AI Revenue Up 143%
- Guide to VISHAY Component Naming Rules & Practical Device Selection
Preface
- Synopsys Rolls Out TSMC N6C/N4C IP Portfolio for Cost‑Optimized AI Chips
- Qualcomm Rolls Out IQ10 Robot Reference Design with up to 700 TOPS for Industrial and Humanoid Bots
- Nvidia N1 Series Arm SoC Specs Leak: N1X and N1 Chips for PC Platform
- Samsung Delivers Industry’s First 12‑Stack HBM4E Samples: 48GB, 3.6TB/s
- ChangXin Memory IPO Clears STAR Market Review, Plans $4.1B Raise
- Kingboard Laminate Raises PCB Material Prices by up to 20% as Raw Material Costs Bite
- NXP TEA1792ATS/1: A Highly Integrated Synchronous Rectifier Controller for Efficient SMPS Designs
- NXP TEA1721FT: A Highly Integrated Flyback Controller for Low-Power SMPS
- The NXP TEA1520P: A Low-Power SMPS Control IC for Efficient Flyback Converters
- NXP TEA1530A: A Comprehensive Guide to the GreenChip SMPS Control IC
- NXP TEA1721FT/N1: A Highly Integrated Flyback Controller for Cost-Effective, Low-Power Adapters
- NXP TDA8933BTW: A Comprehensive Technical Overview of the 15 W Class-D Audio Amplifier
- NXP TDA8950TH/N1,118: A 2 x 150W High-Efficiency Class-D Audio Amplifier
- NXP TEA1738FT/N1: A High-Performance SMPS Controller IC for Cost-Effective Power Supply Designs
- Domestic MEMS Chip‑Level Fan Cools CPU with Near‑Zero Noise – China’s Thermal Breakthrough
- Samsung’s Non‑Chip Workers Seek Court Order Over Vast Pay Gap vs Semiconductor Staff
- Unigroup Guoxin Buys Raynen Semiconductor for $263M to Boost Power Semi IDM
- TSMC Targets Panel‑Level Packaging with CoPoS Platform, Mass Production by 2028
- US FTC Launches Antitrust Probe into Arm Over Licensing Practices
- Power Management IC Prices Rise as Foundry, Assembly Costs Bite – PMIC Makers Set for H2 Upside
- Unlocking the Power of the NXP LPC54113J128BD64: A Dual-Core Cortex-M4/M0+ Microcontroller for Energy-Efficient Embedded Designs
- NXP BZX585-C12: A Comprehensive Technical Overview of the 12V Precision Zener Diode
- HEF4894BT: A 12-Stage Binary Ripple Counter with Inverted Outputs for Digital Logic Systems
- The NXP SPC5746CSK1AMMH6 32-Bit MCU: A High-Performance Automotive Microcontroller for Safety-Critical Systems
- NXP S9S12XS128J1CAE: A Comprehensive Technical Overview of the 16-bit HCS12X Microcontroller Family
- NXP MC9S08AC8CFJE: An In-Depth Technical Overview of the 8-bit HCS08 Microcontroller
- NXP S9S12HY64J0MLH: A Comprehensive Technical Overview of the 16-bit HCS12 Microcontroller Family
- SMIC Q1 Revenue Hits Record $2.505B, Guides 14–16% Growth in Q2
- NXP PMEG2005EL: A Detailed Analysis of Its Key Features and Circuit Design Applications
- Tencent to Boost Domestic AI Chip Usage in H2 2026, Scaling Huawei Ascend and More
- ams OSRAM Sells CMOS Image Sensor Business to indie Semiconductor for €40M
- US Reveals $2.5B Nvidia GPU Smuggling Ring: Bangkok’s OBON Named as ‘Company-1’
- NXP 74AHC573D: A Comprehensive Technical Overview of the Advanced High-Speed CMOS Octal D-Type Latch
- NXP BUK7905-40AIE: A High-Performance 40V Automotive TrenchMOS Power MOSFET
- NXP BYV29-200: A High-Performance Ultrafast Rectifier for Power Conversion Applications
- NXP LPC1114FHN33/303Y: A Comprehensive Technical Overview of the ARM Cortex-M0 Microcontroller
- Unlocking the Power of the NXP LPC54114J256UK49Z: A Dual-Core Cortex-M4/M0+ Microcontroller for Advanced Low-Power Embedded Designs
- NXP LPC4088FET208,551: A Comprehensive Technical Overview and Application Guide
- NXP LPC1837JET100E: A Comprehensive Technical Overview of the High-Performance ARM Cortex-M3 Microcontroller
- NXP 74AHC244BQ: High-Speed Octal Buffer/Line Driver with 3-State Outputs
- Sunlord’s AI Inductors Enter Mass Production, Tantalum Caps Ramp Up in eSSD and Data Centers
- Murata to Invest ¥80 Billion in MLCC Expansion, Targets Data Center Demand
- India Approves Two New Semiconductor Projects – Enters GaN Foundry Race
- Apple Courts Intel & Samsung for Chip Foundry as Samsung Hits $1 Trillion
- PCF8563BS/4,118: NXP's Low-Power Real-Time Clock/Calendar IC for Embedded Systems
- NXP PESD3V3V4UW: Ultra-Low Capacitance TVS Diode for High-Speed Data Line Protection
- PCF85053ATKJ: NXP's Ultra-Low-Power Real-Time Clock for Precision Timekeeping in Embedded Systems
- NXP PMBFJ308: JFET Transistor Datasheet, Application Circuits, and Replacement Guide
- The NXP FS32K146HFT0VLHT is a highly integrated 32-bit microcontroller unit (MCU) from NXP Semiconductors' S32K1xx family, specifically designed to meet the stringent requirements of automotive a
- NXP PN7362AUHN/C300Y: A Comprehensive Technical Overview of the High-Performance NFC Controller
- NXP 74LVCH1T45GW: A Single-Bit Dual-Supply Bidirectional Voltage-Level Translator
- NXP PDZ24B: A Comprehensive Technical Overview of the 24V Zener Diode for Circuit Protection
- Xiamen Silan Jihua Gets 1,944% Capital Injection – $700M for 12‑Inch Analog Fab
- MCIMX6U5EVM10AD: NXP's i.MX 6UltraLite Evaluation Platform for Secure, Low-Power Applications
- PCF8579HT/1: NXP's Low-Power 96-Segment LCD Driver for Advanced Display Applications
- NXP S9S08SG16E1MTG: A Comprehensive Technical Overview of the 8-bit HCS08 Microcontroller
- NXP PCA9554DB: I2C-Bus Controlled 8-Bit I/O Expander for Interfacing with Microcontrollers
- NXP MMPF0100F6ANES: A Comprehensive Technical Overview of the Programmable Power Management IC
- NXP S912XHZ256F1VAG: A High-Performance 32-Bit Automotive Microcontroller for Next-Generation Vehicle Systems
- Unveiling the NXP MKE14Z256VLH7R: A Comprehensive Exploration of its ARM Cortex-M4 Core, Secure Cryptographic Acceleration, and Industrial IoT Applications
- NXP MP3V5050GC6U: A Comprehensive Technical Overview of the Integrated Pressure Sensor
- NXP Q1 Revenue Rises 12%, Net Profit Doubles – Auto & Industrial Rebound
- Tri-Circuit’s 1μm MLCC Breakthrough – $9B Revenue Hides a High-End Secret
- VeriSilicon’s Orders Explode to $4.5B – AI ASIC Drives 85% of New Deals
- China IC Fund Cuts Stake in Techbond – Third Sale in 12 Months
- 8-Inch Wafer Foundry Price Hikes Spread – DB HiTek, SMIC, UMC, PSMC, Vanguard All In